Partnership promises to improve application rates for recruitment users.

Cornerstone meets Stepstone.

Cornerstone OnDemand, Inc. (NASDAQ: CSOD), a global leader in cloud-based learning and human capital management software, has announced a partnership with StepStone which will improve application rates for new and existing Cornerstone Recruitment suite clients. Cornerstone Human Capital Management (HCM) platform includes the Recruitment suite which addresses all talent acquisition needs – including applicant tracking – to strengthen the end-to-end candidate experience.

StepStone has integrated Cornerstone into its ATSi Apply programme to deliver dramatically improved job application completions on Totaljobs, Jobsite, Caterer, or any other of StepStone’s ten UK job boards.

The partnership improves the candidate’s experience by providing a seamless application process on any device with easy reapplication. StepStone’s latest version of ATSi Apply has improved tracking capabilities, and Cornerstone clients who post job ads on StepStone job boards, will benefit from application rates being improved by up to 90 per cent.

Bonnie Andrews, head of product at Totaljobs and Jobsite, comments: “Clients tell us that the non-completion of job advertising applications continue to reduce the performance of their applicant tracking systems. Since we created ATSi Apply in 2015, we’ve continued to develop this product to ensure that the recruiter gets more value for money. Cornerstone is the largest ATS provider we’ve partnered with and we’re already seeing the positive impact this integration is having with its clients.”

“Candidates have high expectations of a seamless, intuitive application process and organisations cannot let talent slip through their fingers,” said David Wood, vice president alliances EMEA, Cornerstone. “Our partnership with StepStone helps our clients maximise job advertising spend, as well as create a more efficient process that will both increase great applicants and shorten time-to-hire, improving productivity.”

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